ATCR1R5-0.5-250mm*250mm
$29.50
Product Overview
The ATCR1R5 series thermal pad is a special compound formed by mixing silicon gel flour and ceramic flour.
It has natural weak adhesion on both sides and provides good thermal conductivity and electrical insulation under low pressure.
The ATCR1R5 series operates stably from -40°C to 150°C and meets UL94 V-0 flame rating. It is a cost-effective thermal interface material for compact devices.
It has natural weak adhesion on both sides and provides good thermal conductivity and electrical insulation under low pressure.
The ATCR1R5 series operates stably from -40°C to 150°C and meets UL94 V-0 flame rating. It is a cost-effective thermal interface material for compact devices.
Specifications
Thermal Conductivity: 1.5 W/m·K
Standard Sheet Size: 200 × 200 mm
Thickness Options: 0.5 / 1.0 / 2.0 / 3.0 / 4.0 / 5.0 mm
Color: Dark gray
Material: Silicon gel & ceramic
Operating Temperature: -40 ~ 150°C
Flame Rating: UL94 V-0
Volume Resistivity: 8.0 × 1015 Ω·cm
Dielectric Constant: 5.75 @ 1 MHz
Insulation Strength (kV/mm): 6.5 (0.5 mm), 8 (1.0 mm), >10 (≥2.0 mm)
Hardness (Shore C): 30 ± 5 (0.5 mm), 18 ± 5 (≥1.0 mm)
Tear Strength (kN/m): 0.80 (≥2.0 mm), 0.70 (3.0–4.0 mm), 0.65 (5.0 mm)
Elongation: 132%–153% (varies by thickness)
Density: 2.5 g/cc
Weight Loss: <0.3% @ 200°C, 240 h
Compliance: 100% Lead (Pb)-free & RoHS Compliant
Typical Applications
Computer cooling modules; cooling devices; high-speed & large-storage drivers; automobile ECU; flat-panel displays; power conversion devices; LED lighting; PDP display screens; LCD backlights.
Download Datasheet
20 in stock (can be backordered)
Additional information
| Weight | 1 lbs |
|---|
