ATE1-35-1AS Sealed TEC / Peltier Module, 4.2V, 1A, 3.2W

Description

Overview

The ATE1-35-1AS is a sealed thermoelectric cooler module in the ATE1-35 series. This series contains 35 pairs of Peltier elements and is designed for precise temperature regulation of target objects in compact thermal-control systems.

The module can be controlled by Analog Technologies TEC controllers to build highly stable and efficient temperature-regulating systems. It can also be used with precision thermistors for accurate and stable temperature sensing in closed-loop temperature-control applications.

The ATE1-35-1AS combines a 1A maximum current rating, 4.2V maximum input voltage, 3.2W maximum cooling power, sealed construction, and standard operating temperature range, making it suitable for compact systems that require fast temperature adjustment and stable thermal control over the standard operating temperature range.

Part Number Decoding

For ATE1-35-1AS:

• 1A — maximum current rating: 1A
• S — sealed version, recommended for moisture-sensitive environments
• No H suffix — standard operating temperature version, rated for operation from -55°C to +85°C

Features

• Sealed thermoelectric cooler module for improved moisture protection
• Standard operating temperature range from -55°C to +85°C
• Compact 30 × 15 × 4.45mm package
• 35 pairs of Peltier elements
• Electrical & thermal ratings: Vmax 4.2V, Imax 1A, Qmax 3.2W, DTmax 62°C
• Highly flat bare ceramic surfaces for thermal paste or thermal pad mounting
• Solder mounting requires metalized ceramic surfaces (custom option, contact Analog Technologies)
• Red positive lead wire and black negative lead wire
• Compatible with TEC controllers and thermistors for closed-loop temperature control
• 100% Lead (Pb)-free and RoHS compliant

Applications

• Solid-state laser temperature stabilization
• Laser chip and laser diode temperature control
• Optical component temperature control
• CCD camera thermal management
• IR camera thermal management
• Bio-tech testing benches
• Precision temperature regulation of compact target objects
• Compact thermal-control assemblies

Key Specifications

Part Number	ATE1-35-1AS
Maximum Current, Imax	1A
Maximum Voltage, Vmax	4.2V
Maximum Cooling Power, Qmax	3.2W
Maximum Temperature Difference, DTmax	62°C
Dimensions	30 × 15 × 4.45mm
Construction	Sealed
Operating Temperature Range	-55°C to +85°C
Lead Wires	Red: positive; Black: negative

ATE1-35 Series Variant Comparison

The ATE1-35 series includes multiple variants. Select the proper model based on maximum current, cooling power, sealing, and operating temperature range.

Models without the H suffix are rated for an operating temperature range of -55°C to +85°C. Models ending with H are rated for an operating temperature range of -55°C to +200°C.

Part Number	Imax	Vmax	Qmax	DTmax	Dimensions	Construction	Operating Temp.
ATE1-35-1AS	1A	4.2V	3.2W	62°C	30 × 15 × 4.45mm	Sealed	-55°C to +85°C
ATE1-35-2AS	2A	4.2V	5.6W	62°C	30 × 15 × 4.24mm	Sealed	-55°C to +85°C
ATE1-35-3AS	3A	4.2V	8.4W	62°C	30 × 15 × 4.50mm	Sealed	-55°C to +85°C
ATE1-35-4AH	4A	4.2V	11.2W	63°C	30 × 15 × 4.4mm	Non-sealed	-55°C to +200°C
ATE1-35-4ASH	4A	4.2V	11.2W	63°C	30 × 15 × 4.4mm	Sealed	-55°C to +200°C
ATE1-35-1ASH	1A	4.2V	2.8W	63°C	30 × 15 × 4.45mm	Sealed	-55°C to +200°C

Mounting and Design Guidelines

Thermal interface options, from preferred to less preferred:

1. Best: metalize the TEC ceramic surfaces and solder the TEC directly to the heat sink and the target object for reliable, low-resistance thermal contact.
2. Recommended: apply a thin layer of thermal paste between the TEC plates and the mating surfaces, with constant mounting pressure. Thermal pad material (thermal filler pads) may be used as a convenient alternative to thermal paste, but it may increase thermal resistance compared with paste.
3. Least preferred: use thermally conductive epoxy to bond the TEC to the heat sink and target object. This approach is less reliable because the epoxy may lose adhesion over time.

Additional design notes:

• Minimize thermal resistance. Good thermal contact between the TEC plates, heat sink, and target object is essential for efficient operation.
• Use constant mounting pressure. Proper pressure helps maintain good thermal contact between the TEC ceramic plates and the mating metal surfaces.
• Improve efficiency by reducing operating DT. The coefficient of performance, COP, is defined as thermal power divided by electrical power. When the operating DT is kept at or below 30°C, COP can be as high as approximately 2.
• Use proper heat sinking. Never operate the TEC without a properly attached heat sink.
• Polarity and cold-side identification. According to the ATE1-35 mechanical drawing, when the red positive lead wire is on the right, the top surface is the cold side.
• Handle carefully. The module can withstand strong orthogonal compression force, but it is vulnerable to tangential forces, especially shock-like tangential forces. A small shock-like tangential force can crack the internal Peltier elements, which may not cause immediate failure but can grow over time, slowly increasing TEC resistance until the module stops operating.

Thermoelectric Generator Mode

When a temperature difference is applied across the two TEC plates, electricity can be generated. In this operating condition, the TEC can function as a thermoelectric generator, or TEG.

Cautions

• Never apply power to the TEC module without a properly attached heat sink.
• Always keep the operating current below Imax to avoid thermal runaway.
• Avoid tangential or shock-like shear forces during handling and installation, as they may crack the internal Peltier elements.

Recommended Pairings

For a complete closed-loop temperature-control system, the ATE1-35-1AS can be paired with Analog Technologies TEC controllers and precision thermistors. The TEC controller provides controlled drive current, while the thermistor provides temperature feedback for accurate regulation.

Custom metalized-surface versions may be available for applications requiring soldered thermal contact between the TEC and the target object. Contact Analog Technologies for details.